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The Main Production Process of Spherical Silicon Powder

wallpapers Industry 2020-11-05
With the continuous advancement of science and technology, microelectronic components' performance continues to improve, and the requirements for packaging technology and packaging materials are getting higher and higher. Because of the superior characteristics of spherical silicon powder that cannot be compared with other quartz powder types, it is gradually being used on a large-scale. In VLSI production, it is playing an increasingly important role in the field of electronic information technology.
The preparation of spherical silica powder is an interdisciplinary and challenging project. Only a few countries worldwide, such as Japan, the United States, Canada, Germany, and Russia, have mastered this technology. Because this technology involves developing high-performance chip technology, the spheronization of silicon micro-powder is highly confidential abroad. The parameters of foreign products obtained are incomplete, and special equipment is rare.
High-temperature plasma melting
This method uses the high-temperature gas generated by AC or DC arc plasma as the heat source and sprays the quartz powder into the plasma flame. The powder is heated and melted and instantly vaporized and then quenched, collected by a cyclone, and a cloth bag to obtain a spherical shape—Silicon powder.
It is characterized by a high heating temperature, which can obtain a temperature field more than five times higher than chemical combustion (above 3000K). The high temperature, high heat, and increased active atmosphere make the chemical reaction proceed quickly, resulting in the rapid formation of high-temperature phase compounds challenging to synthesize by the chemical liquid phase method. (Such as nitrides, carbides, borides, etc.); when the reaction material leaves the plasma, the particles will no longer grow after rapid cooling; the plasma state of different atmospheres can be formed according to different needs. The range of reactants is wide.
Disadvantages: Plasma technology is complicated. First, the plasma temperature field is affected by the magnetic and electrical properties of the plasma. The temperature field is small and concentrated. The stable high-temperature area of the heating device is not easy to control. The temperature range is not easy to adjust; secondly, the plasma the current passing realizes the generation of energy and jet through the ionized gas medium. Too much dilution of the plasma will interrupt the current and lose its effect. These factors make the spheroidization rate of the product difficult to control and difficult to form large-scale production.
High-temperature melt jet
This method is to put the material in a high-temperature field to melt it into a melt. When the melt flows out, it is sprayed with high-pressure air through the ejector, and the melt is dispersed and broken into a misty liquid by the high-speed airflow. When the droplets are cooled quickly, the small droplets will naturally shrink into spherical particles with a smooth surface when they are cold. The high-temperature melt spray method is the easiest method to ensure spheroidization and amorphous rate. However, it is difficult to break through a series of critical technologies such as furnace high-temperature materials, viscous quartz melt atomization, and secondary pollution prevention. It is quite challenging to manufacture high-purity spherical quartz powder.

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